TECHNICAL PROGRAM COMMITTEE

NAMEORGANIZATION
John D. AdamWestinghouse Electric Corp.
Eric L. Adler McGill University
George A. Alers Natl. Inst. of Stnds. & Tech.
Adriano Alippi Instituto Di Acustica-CNR
Rodolfo Almar SAWTEK Inc.
Gary L. Anderson U. S. Army research Office
Arthur Ballato (Vice Chair) U. S. Army Research Lab.
Narendra K. Batra Naval Research Lab.
Genevieve Berger Laboratoire Imagerie Parametrique
Raymond J. Besson Ecole Nationale Superieure de Mechanique et des Microtechniques
Kushal Bhattacharjee TRW Electronics & Tech. Div.
Nihat M. Bilgutay Drexel University
Gerald V. Blessing Natl. Inst. of Stnds. & Tech.
Gary H. Brandenburger Mallinckrodt Medical, Inc.
Mack A. Breazeale University of Mississippi
Jan Brown JB Consulting
Lewis Brown South Dakota State University
Charles A. Cain University of Michigan
David Cheeke Concordia University
L. Eric Cross The Pennsylvania State University
Helge E. Engan Norwegian Institute of Technology
Helmut Ermert Ruhr University
Gerald W. Farnell McGill University
Katherine Ferrara (Vice Chair) University of Virginia
Matthias Fink Universite Paris 7
Stuart Foster University of Toronto
Leon Frizzell University of Illinois
Eric S. Ferguson (Vice Chair) Purdue University
Jean-Francois Gelly Thomson Microsonics
Gerard Gimenez URA CNRS CREATIS
Brage Golding Michigan State University
James F. Greenleaf Mayo Clinic
Thomas W. Grudkowski United Technologies Research Center
Daniel Hauden CNRS-LPMO
David L. Hecht XEROX PARC
Janpu Hou Allied Signal, Inc.
William D. Hunt Georgia Institute of Technology
Masao Ide Musashi Institute of Technology
Shen Jen Hartman Research, Inc.
Lawrence W. Kessler Sonoscan, Inc.
B. T. Khuri-Yakub (Chair) Stanford University
Doron Kishoni College of William and Mary
John A. Kosinski U. S. Army Communications-Electronics Command.
Kenneth Lakin TFR Technologies, Inc.
Oswald Leroy K. U. L.
Reinhard Lerch University of Linz
Moises Levy University of Wisconsin-Mil
Charles Maerfeld Thomson Microsonics
Bruce R. McAvoy Pittsburgh, PA
Donald C. Malocha University of Central Florida
James G. Miller Washington University
Gary K. Montress (Vice Chair) Raytheon Company
Robert A. Moore Arnold, MD
M. Edward Motamedi Rockwell Int'l. Science Center
Bernard Nouailhas EDF-DER
William D. O'Brien, Jr. University of Illinois
Dennis R. Pape Photonic Systems, Inc.
David Penunuri Motorola, Inc.
Victor Plessky Advanced SAW Products, SA
Bob R. Potter Vectron Technologies
Valeri Proklov Inst. of Radio Eng. & Elec.
Gerard J. Quentin Universite Paris 6
Arne Ronnekleiv Norwegian Inst. of Technology
Martine Rousseau University Paris 6
Helen F. Routh Applied Technology Labortories
Daniel Royer University Paris 7
Clemens C. W. Ruppel Siemens AG
Harry L. Salvo, Jr. Westinghouse Electric Corp.
Jafar Saniie Illinois Inst. of Technology
Mark E. Schafer Sonic Technologies, Inc.
Susan C. Schneider Marquette University
Jeffrey S. Schoenwald Rockwell International
Tadashi Shiosaki Kyoto University
Thomas Shoup Hewlett Packard
Kirk Shung The Pennsylvania State University
Tony Sinclair University of Toronto
Bikash K. Sinha Schlumberger-Doll Research Center
Peter M. Smith McMaster University
Wallace A. Smith Office of Naval Research
Jan G. Smits Boston College
Richard Stacey City University
Roger H. Tancrell Tancrell Associates
Lewis J. Thomas General Electric
Kai Thomenius Interspec, Inc.
Bernhard R. Tittmann The Pennsylvania State University
Chen S. Tsai University of California-Irvine
Jiromaru Tsujino Kanagawa University
Joseph Trivisonno John Carroll University
John R. Vig U. S. Army research Laboratory
James W. Wagner Johns Hopkins University
Peter V. Wright RF Monolithics, Inc.
Kazuhiko Yamanouchi Tohoku University
Yook-Kong Yong Rutgers University
Donald E. Yuhas IMS, Inc.
Manell E. Zakharia LASSSO



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