TECHNICAL PROGRAM COMMITTEE

Group I (Vice Chair: Ton van der Steen - Medical Ultrasonics)

Olivier Basset, INSA Lyon France, France
Genevieve Berger, CNRS, France
Gary H. Brandenburger, Mallinckrodt Medical Inc., USA
Richard Y. Chiao, GE Medical Systems, USA
Lawrence A. Crum, University of Washington, USA
Emad S. Ebbini, University of Minnesota, USA
Helmut Ermert, Ruhr University, Germany
Katherine Ferrara, University of California-Davis, USA
Mathias Fink, Universite Denis Diderot, France
Stuart Foster, Sunnybrook Health Science Center, Canada
James F. Greenleaf, Mayo Clinic, USA
John Hossack, University of Virginia, USA
Masao Ide, Musashi Inst. of Technology, Japan
Michael Insana, University of California-Davis, USA
Joergen Arendt Jensen, Technical University of Denmark, Denmark
Hiroshi Kanai, Tohoku University, Japan
Jin Kim, Siemens Ultrasound group, USA
Donald Liu, Siemens Ultrasound group, USA
Jian-yu Lu, The University of Toledo, Ohio, USA
Leonardo Masotti, University Florence, Italy
James G. Miller, Washington University, USA
Kathy Nightingale, Duke University, USA
William D. O'Brien, Jr., University of Illinois, USA
Helen F. Routh, Philips Medical Systems/ATL Ultrasound, USA
Lewis Thomas, Siemens/Acuson, USA
Kai Thomenius, GE CRD, USA
Piero Tortoli, University of Florence, Italy
Ton van der Steen, Erasmus University Rotterdam, The Netherlands
Sadayuki Ueha, Tokyo Institute of Technology, Japan
Keith Wear, Food and Drug Administration, USA

Group II (Vice Chair: Donald E. Yuhas - Sensors, NDE, and Industrial Applications):

Robert C. Addison, Rockwell Science Center, USA
George Alers, NIST, USA
Narendra K. Batra, Naval Research Lab/Code 6380, USA
Nihat M. Bilgutay, Drexel University, USA
Gerald V. Blessing, NIST, USA
David Cheeke, Concordia University, Canada
Eric S. Furgason, Purdue University, USA
Bernhard Jakoby, Robert BoschGmbHK8/SPP5, Germany
Lawrence W. Kessler, Sonoscan, Inc.
Pierre T. Khuri-Yakub, Stanford University, USA
Jun-ichi Kushibiki, Tohoku University, Japan
Roman Gr. Maev, University of Windsor, Canada
Massimo Pappalardo, University Di Roma TRE, Italy
Gerard J. Quentin, Laboratoire d'Imagerie Parametrique, France
Daniel Royer, Universite de Paris VII, France
Jafar Saniie, Illinois Inst. of Technology, USA
Jeffrey S. Schoenwald, Solus Micro Technologies, USA
Tony Sinclair, University of Toronto, Canada
Bernhard R. Tittmann, Pennsylvania State University, USA
Jiromaru Tsujino, Kanagawa University, Japan
Michael J. Vellekoop, Delft University of Technology, Netherlands
Donald E. Yuhas, Industrial Measurement Systems, Inc, USA
John F. Vetelino, University of Maine, Maine, USA
Manell E. Zakharia, Ecole Navale French Naval Academy, France

Group III (Vice Chair: Bikash Sinha - Physical Acoustics):

Arthur Ballato, US Army CECOM RDEC, USA
Mack A. Breazeale, University of Mississippi, USA
Jan Brown, JB Consulting, USA
Helge F. Engan, Norwegian Inst of Technology, Norway
Gerald W. Farnell, McGill University, Canada
Brage Golding, Michigan State University, USA
David L. Hecht, Xerox Corporation, USA
Fred S. Hickernell, Motorola Inc., USA
Kenneth Lakin, TFR Technologies, inc., USA
Amit Lal, University of Wisconsin-Madison, USA
John D. Larson, Agilent Laboratories
Moises Levy, M and N Consulting, USA
George D. Mansfield, Russia Academy of Sciences, Russia
Kiyoshi Nakamura, Tohoku University, Japan
Dennis R. Pape, Photonic Systems, Inc., USA
Valeri Proklov, Inst of Radio Engr. & Electricity, Russia
Susan C. Schneider, Marquette University, USA
Bikash K. Sinha, Schlumberger-Doll Research, USA
Jan G. Smits, Boston University, USA
Kenshiro Takagi, University of Tokyo, Japan
Joseph Trivisonno, John Carroll University, USA
Yook-Kong Yong, Rutgers University, USA
John R. Vig, US Army CE COM, USA

Group IV (Vice Chair: Don Malocha - Surface Acoustic Waves):

Benjamin P. Abbott, Sawtek Inc., USA
Ali Bagi-Wadji, Mints Radiotechnical Institute, Russia
Kushal Bhattacharjee, Clarisay, USA
Serguey Biryukov, Solid State and Materials Research, Germany
Thomas W. Grudkowski, Emerson Electric Company, USA
Ken-ya Hashimoto, Chiba University, Japan
Daniel Hauden, CNRS-LPMO, France
Mitsutaka Hikita, Hitachi, Ltd., Japan
Shen Jen, Crystal Photonics, Inc., USA
John A. Kosinski, US Army Communications Electronics Cmd., USA
Don C. Malocha, University of Central Florida, USA
Gary K. Montress, Raytheon Company, USA
Mauricio Pereira da Cunha, University of Maine, USA
Viktor Plesski, Thales Microsonics, Switzerland
Bob R. Potter, Vectron International, USA
Arne Ronnekleiv, Norwegian Institute of Technology, Norway
Clemens C. W. Ruppel, EPCOS AG, Germany
Yoshio Satoh, Fujitsu Laboratories Ltd., Japan
Peter M. Smith, McMaster University, Canada
Daniel F. Thompson
Robert Weigel, Johannes Kepler Universitat Linz, Austria
Peter V. Wright, Triquint Semiconductor,USA

Group V (Vice Chair: Lewis Brown - Transducers & Transducer Materials):

Lewis F. Brown, South Dakota State University, USA
Jean-Francois Gelly, Thomson Microsonics, France
Hal Kunkel, Philips Medical Systems/ATL Ultrasound, USA
Reinhard Lerch, University of Erlangen, Germany
Geoff Lockwood, Queen's University, Canada
Mark E. Schafer, Perceptron, Inc., USA
K. Kirk Shung, Pennsylvania State University, USA
Scott Smith, GE Corporate R&D, USA
Stephen W. Smith, Duke University, USA
Wallace A. Smith, Office of Naval Research, USA
Yasuhito Takeuchi, Kagoshima University, Japan
Roger H. Tancrell, Airmar Technology Corp., USA
Qiming Zhang, Pennsylvania State University, USA