Technical Program Committee

Medical Ultrasonics

Vice-Chair: Alfred C. H. Yu, University of Waterloo, Canada

 

 

  1. Mike Averkiou, University of Washington, USA
  2. Mark Borden, University of Colorado Boulder, USA
  3. Ayache Bouakaz, INSERM, France
  4. Lori Bridal, University Pierre and Marie Curie, France
  5. Matthew F. Bruce, University of Washington, USA
  6. Charles A. Cain, University of Michigan, USA
  7. Jean-Yves Chapelon, INSERM, France
  8. Magnus Cinthio, Lund University, Sweden
  9. Guy Cloutier, University of Montreal, Canada
  10. Jeremy Dahl, Stanford University, USA
  11. Paul A. Dayton, University North Carolina/NCSU, USA
  12. Marvin Doyley, University of Rochester, USA
  13. Nico de Jong, Erasmus Medical Centre, The Netherlands
  14. Chris de Korte, Radboud University Medical, The Netherlands
  15. Jan Dhooge, Catholic University of Leuven, Belgium
  16. Emad Ebbini, University of Minnesota, USA
  17. Stas Emelianov, Georgia Institute of Technology and Emory University School of Medicine, USA
  18. Mostafa Fatemi, Mayo Clinic, USA
  19. Kathy Ferrara, University of California Davis, USA
  20. Stuart Foster, University of Toronto, Canada
  21. Brian Fowlkes, University of Michigan, USA
  22. Steven Freear, University of Leeds, UK
  23. Caterina Gallippi, University of North Carolina, USA
  24. Damien Garcia, CREATIS, France
  25. James Greenleaf, Mayo Clinic, USA
  26. Peter Hoskins, University of Edinburgh, UK
  27. John Hossack, University of Virginia, USA
  28. Kullervo Hynynen, University of Toronto, Canada
  29. Jørgen Arendt Jensen, Technical University Denmark, Denmark
  30. Hiroshi Kanai, Tohoku University, Japan
  31. Jeff Ketterling, Riverside Research, USA
  32. Kang Kim, University of Pittsburgh, USA
  33. Michael Kolios, Ryerson University, Canada
  34. Elisa Konofagou, Columbia University, USA
  35. Nobuki Kudo, Hokkaido University, Japan
  36. Roberto Lavarello, Pontificia Universidad Catolica, Peru
  37. Pai-Chi Li, National Taiwan University, Taiwan
  38. Hervé Liebgott, CREATIS, France
  39. Thanasis Loupas, Philips Ultrasound, USA
  40. Lasse Løvstakken, Norwegian University of Science and Technology, Norway
  41. Jian-yu Lu, University of Toledo, USA
  42. James G. Miller, Washington University in St. Louis, USA
  43. Massimo Mischi, Einhoven University of Technology, The Netherlands
  44. Larry Mo, GE Global Research, USA
  45. Helen Mulvana, University of Glasgow, UK
  46. Kathy Nightingale, Duke University, USA
  47. Svetoslav Nikolov, BK Ultrasound, Denmark
  48. William D. O’Brien, University of Illinois, USA
  49. Michael Oelze, University of Illinois, USA
  50. Georg Schmitz, Ruhr-Universitat Bochum, Germany
  51. Ralf Seip, SonaCare Medical, USA
  52. Mickael Tanter, INSERM, France
  53. Kai E. Thomenius, Massachusetts Institute of Technology, USA
  54. Hans Torp, University of Science and Technology, Norway
  55. Piero Tortoli, University of Florence, Italy
  56. Matthew W. Urban, Mayo Clinic, USA
  57. Ton van der Steen, Erasmus Medical Centre, The Netherlands
  58. Mingxi Wan, Xi’an Jiaotong University, China
  59. Kendall Waters, Silicon Valley Medical Instruments, USA
  60. Keith Wear, Food and Drug Administration, USA
  61. Wilko G. Wilkening, Siemens Medical Solutions , USA
  62. Chih-Kuang Yeh, National Tsing Hua University, Taiwan
  63. Alfred Yu, University of Waterloo, Canada
  64. Roger J. Zemp, University of Alberta, Canada
  65. Hairong Zheng, Shenzhen Institutes of Advanced Technology, China

Sensors, NDE & Industrial application

Vice-Chair: Oruklu Erdal, Illinois Institute of Technology, USA

 

 

  1. Robert C. Addison, Rockwell Science Center
  2. Walter Arnold, Fraunhofer Institute for NDT, Germany
  3. James Blackshire, Air Force Research Laboratory, USA
  4. Ramazan Demirli, Villanova University, USA
  5. James Friend,UCSD, USA
  6. David Greve, Carnegie Mellon University, USA
  7. Edward Haeggström, University of Helsinki, Finland
  8. Joel Harley, University of Utah, USA
  9. Jacqueline Hines, Applied Sensor R&D Corporation, USA
  10. Patrick Johnston, NASA Langley Research Center
  11. Lawrence W. Kessler, Sonoscan Inc.
  12. Mario Kupnik, Technische Universität Darmstadt, Germany
  13. Roman Maev, University of Windsor
  14. Donald McCann, Seadrill, USA
  15. Jennifer Michaels,Georgia Tech, USA
  16. Kentaro Nakamura, Tokyo Institute of Technology, Japan
  17. Erdal Oruklu, Illinois Institute of Technology, USA
  18. Nishal Ramadas, Elster Instromet, Belgium, UK
  19. Jafar Saniie, Illinois Institute of Technology, USA
  20. Bernhard Tittman, Pennsylvania State University, USA
  21. Jiromaru Tsujino, Kanagawa University, Japan
  22. John F. Vetelino, University of Maine, USA
  23. Paul Wilcox, University of Bristol, UK
  24. William Wright, University College Cork, Ireland
  25. Donald E. Yuhas, Industrial Measurement Systems, USA

 Physical acoustics

Vice Chair: Koen W.A. van Dongen, Delft University of Technology, Netherlands

 

 

  1. Arthur Ballato, Clemson University, USA
  2. Anne Bernassau, Heriot Watt University, UK
  3. Jan Brown, JB Consulting, USA
  4. Charles Courtney, University of Bath, UK
  5. Jianke Du, Ningbo University, China
  6. Dave Feld, Broadcom Ltd, USA
  7. Yun Jing, North Carolina State University, USA
  8. Takefumi Kanda, Okayama University, Japan
  9. Eun Sok Kim, University of Southern California, USA
  10. Kimmo Kokkonen, Qorvo, Germany
  11. Minoru Kuribayashi Kurosawa, Tokyo Institute of Technology, Japan
  12. Amit Lal, Cornell University, USA
  13. John Larson, Broadcom Ltd, USA
  14. Vincent Laude, FEMTO-ST / CNRS, France
  15. Margaret Lucas, University of Glasgow Scotland, UK
  16. Andreas Mayer, HS Offenburg – Univ. of Applied Sciences, Germany
  17. Alex Maznev, MIT, USA
  18. Robert J. McGough, MSU, USA
  19. Farid Mitri, Chevron, USA
  20. Mihir Patel, Schlumberger-Doll Research, USA
  21. Yan Pennec, IEMN / Universite de Lille 1, France
  22. Bikash Sinha, USA
  23. Masaya Takasaki, Saitama University, Japan
  24. Robert Thalhammer, Broadcom Ltd, Germany
  25. Koen W.A. van Dongen, Delft University of Technology, Netherlands
  26. István A. Veres, Qorvo Inc., USA
  27. Jörg Wallaschek, Leibniz Universität Hannover, Germany
  28. Ji Wang, Ningbo University, China
  29. Takahiko Yanagitani, Waseda University, Japan
  30. Yook-Kong Yong, Rutgers University, USA
  31. Jiun-Der Yu, Qualcomm Technologies, Inc., USA

Micro-acoustics SAW, FBAR, MEMS

Vice Chair: Shuji Tanaka, Tohoku University, Japan

 

 

  1. Sylvain Ballandras,frec|n|sys SASU, France
  2. Sunil Bhave, Purdue University, USA
  3. Sergey Biryukov, Leibniz Institute for Solid State and Materials Research, Germany
  4. Paul Bradley, Broadcom Ltd, USA
  5. Jidong Dai, Murata Electronics North America, Inc., USA
  6. Omar Elmazria, Université de Lorraine, France
  7. Gerhard Fischerauer, Universität Bayreuth, Germany
  8. Amelie Hagelauer, University of Erlangen-Nuremberg, Germany
  9. Tao Han, Shanghai Jiao Tong University, China
  10. Ken-ya Hashimoto, Chiba University, Japan
  11. Shogo Inoue, Qorvo,Inc, USA
  12. Michio Kadota, Tohoku University, Japan
  13. Jyrki Kaitila, Broadcom Ltd, Germany
  14. Jan Kuypers, Qorvo,Inc, USA
  15. Ryo Nakagawa, Murata Manufacturing Co., Ltd., Japan
  16. Hiroyuki Nakamura, Skyworks Solutions, Inc., Japan
  17. Natalya Naumenko, National University of Science and Technology “MISIS”, Russia
  18. Tuomas Pensala, VTT Technical Research Centre of Finland, Finland
  19. Mauricio Pereira da Cunha, University of Maine, USA
  20. Maximilian Pitschi, RF360 Europe GmbH, Germany
  21. Leonhard Reindl, Albert-Ludwigs-Universität Freiburg, Germany
  22. Rich Ruby, Broadcom Ltd, USA
  23. Marc Solal, Qorvo,Inc, USA
  24. Shuji Tanaka, Tohoku University, Japan
  25. Masanori Ueda, TAIYO YUDEN CO., LTD., JAPAN
  26. Karl Wagner, RF360 Europe GmbH, Germany
  27. Robert Weigel, University of Erlangen-Nuremberg, Germany
  28. Ventsislav Yantchev, Chalmers University of Technology, USA
  29. Sergei Zhgoon, National Research University “MPEI”, Russia

Transducers and transducers material

Vice Chair: Sandy Cochran, University of Glasgow, UK

 

 

  1. Jeremy Brown, Dalhousie University, Halifax, Canada
  2. Sandy Cochran, University of Glasgow, UK
  3. David Cowell, University of Leeds, UK
  4. Christopher Daft, River Sonic Solutions, USA
  5. Loriann Davidsen, Philips Healthcare, USA
  6. Christine Démoré, University of Glasgow, UK
  7. Charles Emery, Ulthera Inc., USA
  8. Arif Sanli Ergun, TOBB University, Turkey
  9. Lynn Ewart-Paine, NUWC, USA
  10. Nicolas Felix, Vermon SA, France
  11. Tomas Gomez, CSIC, Madrid, Spain
  12. Anne-Christine Hladky, Institut Supérieur d’Electronique et du Numérique, France
  13. Xiaoning Jiang, North Carolina State University, USA
  14. Valsala Kurusingal, Thales Australia, Australia
  15. Ho-yong Lee, Ceracomp Co., Ltd, Korea
  16. Richard O’Leary, University of Strathclyde, UK
  17. Franck Levassort, Francois-Rabelais University of Tours, Tours, France
  18. Omer Oralkan, North Carolina State University, USA
  19. Weibao Qiu, Shenzhen Institutes of Advanced Technology, China
  20. Wei Ren, Xi’an Jiaotong University, China
  21. Yongrae Roh, Kyungpook National University, Korea
  22. Stefan Rupitsch, University of Erlangen-Nuremberg, Germany
  23. Jean-Francois Saillant, Areva, France
  24. Alessandro Savoia, Universita degli Studi Roma Tre, Italy
  25. Wallace Smith, Office of Naval Research, USA
  26. Susan Trolier-McKinstry, Pennsylvania State University, USA
  27. Jian Yuan, ALS Shanghai, China
  28. Shujun Zhang, University of Wollongong, Australia
  29. Qifa Zhou, University of Southern California, USA